Intel shared new chip technologies at the IFS Direct Connect event in San Jose, offering a look into future data-center processors. They introduced advancements in 3D stacking and connectivity, marking a shift for Intel as they transition to a foundry business model. Clearwater Forest, a server CPU, showcases a system-on-a-chip design that can scale up to 300 billion transistors. Intel highlighted innovative features such as backside power delivery and RibbonFET transistor architecture. The introduction of hybrid bonding technology aims to improve energy efficiency in server chips. Overall, Intel is pushing the boundaries of chip technology with their upcoming product offerings.
https://spectrum.ieee.org/intel-18a