The drive for faster chips leads to more energy passing through smaller devices, posing challenges for chip reliability, particularly in advanced packages with multiple chiplets. Electromigration, where metal atoms move due to high current density, is a growing concern in these designs, impacting solder joints, interconnects, and copper redistribution layers. Managing thermal pathways, especially in 3D-ICs, is crucial to addressing electromigration. Researchers are studying failure mechanisms and developing models to predict and prevent electromigration issues. Engineering for electromigration resilience involves using specific designs and materials, tight process control, and proactive measures to ensure device durability. Modeling and simulation play a crucial role in identifying and addressing potential electromigration failures before manufacturing begins.
https://semiengineering.com/electromigration-concerns-grow-in-advanced-packages/