At the University of Massachusetts Amherst, researchers have developed a groundbreaking method to align 3D semiconductor chips using concentric metalenses and holograms. This innovative technique can revolutionize the production of semiconductor chips by lowering costs and enabling the creation of 3D photonic and electronic chips. The traditional microscope-based alignment methods are proving inadequate for making these cutting-edge 3D chips. The new method, which involves shining a laser through alignment marks on the chips, can detect errors as small as a few nanometers, far exceeding previous expectations. This advancement has significant implications for the semiconductor industry and paves the way for a range of new sensor technologies.
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