The three leading-edge foundries — Intel, Samsung, and TSMC — have aggressive delivery dates for future generations of chip technology, taking their own paths towards improved performance and faster custom designs. The focus is on 3D transistors, enabling technologies, and diverse ecosystems. They all plan to continue transistor scaling down to 18/16/14 angstroms, with possible advancements like CFETs. Customizable chiplet assemblies are key, allowing for rapid domain-specific designs. Intel, Samsung, and TSMC each offer unique interconnect solutions, but face challenges with heat dissipation and complex chiplet integration. Scaling up will involve more specialized processors in advanced packaging configurations, with a focus on performance per watt in specific domains. Innovation includes stacking logic-on-logic in 3D-IC configurations for improved efficiency and performance. Intel, Samsung, and TSMC are all pushing boundaries to meet evolving market demands.
https://semiengineering.com/intel-vs-samsung-vs-tsmc/