Mold 2.0

Mold 2.0.0 is a newly released high-speed linker with a change in license from AGPL to MIT. This shift in licensing was a result of our unsuccessful attempt to monetize the product using a dual-licensing scheme. We have accepted the reality and changed the license to expand our user base. We also welcome GitHub sponsors to support our work. Along with the license change, this release includes several updates and bug fixes. Notably, the bug that limited the number of sections in object files has been resolved. There are also improvements in compatibility, support for specific relocation types, and handling of certain options.

To top