Reverse-engineering and analysis of SanDisk High Endurance microSDXC card (2020)

SanDisk High Endurance cards use SanDisk/Toshiba 3D TLC Flash. SanDisk MAX Endurance uses the same 3D TLC in pMLC mode. SanDisk’s lack of detailed specifications led to the need for reverse-engineering. The process to uncover chip information and the construction of a breakout board is detailed, including the analysis of test pads. Identification of the SD card’s NAND Flash memory revealed 3D TLC NAND and its characteristics. Utilizing a microcontroller exposed the controller’s reset line. SanDisk deviated from standards by using a non-standard JEDEC Parameter Page format, proclaiming SNDK instead of JEDEC. The article concludes with a hex dump of the Parameter Page data.

https://ripitapart.com/2020/07/16/reverse-engineering-and-analysis-of-sandisk-high-endurance-microsdxc-card/

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