Power issues dominate the design and storage of data, as chip transistor density has reached levels that generate more heat than usual. The industry is working to solve these issues by introducing new transistor structures like gate-all-around FETs at 3nm. The power delivery system is also evolving to address routing problems. Thermal analysis is essential to prevent dielectric breakdown, electromigration, and other aging effects that can degrade performance. There is a focus on hardware-software co-design, faster interconnects, and new power delivery options to improve efficiency and prevent hardware failures. Ultimately, each new chip generation presents unique challenges that must be addressed.
https://semiengineering.com/the-rising-price-of-power-in-chips/