Intel is all-in on backside power delivery

Intel has tested a way of boosting computer chip performance and reducing power use through its PowerVia technology that could be used in the developing of its next generation of processors. PowerVia moves power interconnects from above silicon to below, enhancing transistors’ performance and enabling cores to be made more compact. The technology could be incorporated with Intel’s 2024 processors, which utilise nanosheet or gate-all-around transistors, and a 20A node. If successful, Intel would beat Samsung and TSMC in offering both nanosheets and PowerVia interconnects. Intel presented the test results at the IEEE Symposium on VLSI Technology and Circuits in Tokyo.

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